“Thin” low adhesion High Insulation masking tape for epoxy molding(prevents epoxy leakage) with fluorosilicone liner

Posted on : dstadmin
PRODUCT DETAILS Thin low adhesion High Insulation masking tape is a highly heat-resistant and excellent insulation effect with fluorosilicone release liner. It is high wettability that prevents epoxy leakage. In addition, the product is laminated with fluorosilicone release liner which can be supplied as die cut. It is also used for high insulation masking process. [...]

High Insulation masking tape for fixing SUS and chip when Semiconductor BGA module manufacturing (for finishing work)

Posted on : dstadmin
PRODUCT DETAILS High Insulation masking tape is a single coated high heat resistance tape used for Semiconductor BGA module manufacturing. It is generally used silicone tape laminated with fluorosilicone release liner that can be supplied as die-cut and suitable for insulation finishing work. The product is also featured with 70um total thickness and 200gf/in peel [...]