High Insulation masking tape for fixing SUS and chip when Semiconductor BGA module manufacturing (for finishing work)
PRODUCT DETAILS High Insulation masking tape is a single coated high heat resistance tape used for Semiconductor BGA module manufacturing. It is generally used silicone tape laminated with fluorosilicone release liner that can be supplied as die-cut and suitable for insulation finishing work. The product is also featured with 70um total thickness and 200gf/in peel [...]