Thermal Release Tape or FPCB etching masking tape is one of the best high heat resistant tape/film which are used for semiconductor, MLCC, FPCB and other electric/electronic components processing. This product is also used for to fix a component temporarily, and then removed easily in specific temperature. The thermal release layer will stay adhesive until heat is applied over a relatively short amount of time, at which point it can then be easily removed without much effort. The thermal release tape “REVALPHA” is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes. Features are Adheres just like any normal adhesive tape at room temperature; can easily be peeled off when necessary by just heating, Various shapes available such as in sheets, rolls and labelers, Available to select temperatures for releasing, Contributes to automation/laborsaving since the tape can be removed at a uniform temperature and Does not damage substrates upon tape removal. This is used for Used for semiconductor, MLCC, FPCB and other electric/electronic components processing ,Fixing a component temporarily, and then removed easily in specific temperature.