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UV-tapes can settle the wafers surely with the strong adhesive strength in the wafer dicing or grinding. After UV irradiation, tapes are easy to be peeled off from the wafer in picking-up or delamination process. Thus, our UV-tapes can improve the quality and save cost, of semiconductor processing. UV-tapes is adhesive tapes that have strong adhesive strength, and characteristic that adhesive strength becoming very small after UV irradiation .After UV irradiation, tapes are easy to be peeled off from the wafer in picking-up or delamination process. Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer micro-fabrication. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame. The dies are later removed from the dicing tape further on in the electronics manufacturing process. Dicing tape can be made of PVCpolyolefin, or polyethylene backing material with an adhesive to hold the dies in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafer. It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal .UV equipment can range from low power (a few mW/cm2) to high power (more than 200mW/cm2). The higher the power the more complete the cure and the lower adhesion and the less adhesive residue is left behind.