Thermal Release Tape or FPCB etching masking tape is one of the best high heat resistant tape/film which are used for semiconductor, MLCC, FPCB and other electric/electronic components processing. This product is also used for to fix a component temporarily, and then removed easily in specific temperature. The thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes. Release Tape is used to seal holes in mould making. Our Flash Breaker Tape, also known as composites release tape is manufactured from the highest quality, high temperature tolerance PET and features a pressure sensitive silicone adhesive which will not leave marks or residue on a mould. Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. It is commonly used to bond integrated circuits to heat sinks where there are no other mounting mechanisms available. Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer micro fabrication. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame.