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Thermal release tapes used to transfer graphene layers from a growth substrate to a handle substrate, but they typically leave a residue on the transferred graphene. It is disclosed that oxygen annealing in the temperature range of 400-450 oC may be used to selectively remove tape residue while leaving the graphene layers intact. Thermal Release Tape or FPCB etching masking tape is one of the best high heat resistant tape/film which are used for semiconductor, MLCC, FPCB and other electric/electronic components processing. This product is also used for to fix a component temporarily, and then removed easily in specific temperature. The thermal release tape is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing processes. The specification describes methods for releasing adhered components to adhesive-backed carrier tapes. It is based on the recognition that with proper choice of the adhesive, i.e. a thermal release adhesive, selectively applied heat will modify the adhesive, eliminating or substantially reducing the adhesion between the tape and the IC chip. This allows components to be picked from the adhesive-backed carrier tape without mechanical assistance. Thermal release adhesives having fast rise times are preferred, allowing for pick and place cycles of less than one second, e.g., less than 0.5 seconds. Preferred means for applying selective heat to the adhesive on the carrier tape are ceramic heaters. Other choices are arc lamps, tungsten halogen lamps, xenon lamps, lasers, and infra-red lamps.