Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). These tapes are tacky pressure sensitive adhesives loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface. The convenience of thermal tapes does not come without risk. Sometimes the thermal resistance for a thick tape can be only slightly better than a dry joint or air gap. Thermal performance would be carefully evaluated along with shear-creep resistance data of the tapes. The materials provide a cost effective means to thermally manage electrical assemblies and form a strong bond between surfaces. The adhesive within Bondline interface materials are designed to flow thus maximizing thermal ‘wet out’ and improving thermal performance. Simple and easy to handle, Bondline materials can be supplied with release liners on one or both sides for easy removal and application.