A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components. With greater diversity and higher quality in chips, dicing tapes also require advanced technology. Elegrip dicing tape is used widely in a variety of applications including silicon and GaAs semiconductors (compound semiconductors), encapsulated package substrates, ceramics, glass, and crystals. Thermal Release Tape or FPCB etching masking tape is one of the best high heat resistant tape/film which are used for semiconductor, MLCC, FPCB and other electric/electronic components processing. This product is also used for to fix a component temporarily, and then removed easily in specific temperature. Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer micro fabrication. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame. The dies are later removed from the dicing tape further on in the electronics manufacturing process. Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the dies in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafer. It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal. UV equipment can range from low power (a few mW/cm2) to high power (more than 200mW/cm2). The higher the power the more complete the cure and the lower adhesion and the less adhesive residue is left behind.