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This is a very low-adhesion film used as a secondary material to improve yield in film and foil processing. It has excellent dimensional stability and causes no heat-shrinkage damage to the adherent product even in high-temperature environments.  It also has strong chemical resistance.

Product Features

  1. Excellent dimensional stability in heating processes and a design that minimizes curling
  2. No adhesive deposit on the adherent product.
  3. Silicon-free release film, so there is no risk of contamination.
  4. Also has excellent chemical resistance and anti-scratch properties


  1. Protective films for preventing film/foil curling, wrinkling and foreign-matter adhesion while undergoing heating.
  2. carrier film for printed circuit board and flexible printed circuit board processes.