UV Tape is polyester based single coated acrylic adhesive tape has high heat resistant and high adhesion strength with excellent initial tack. The product is coated with layer of acrylic adhesive, PET release liner and PET Film. It consist 70um total thickness and 1100 gf/in peel strength. As the product has strong adhesion and easy to remove so no residue after removal. UV-tapes is adhesive tapes that have strong adhesive strength, and characteristic that adhesive strength becoming very small after UV irradiation.UV-tapes can settle the wafers surely with the strong adhesive strength in the wafer dicing or grinding. After UV irradiation, tapes are easy to be peeled off from the wafer in picking-up or delamination process. Thus, our UV-tapes can improve the quality and save cost, of semiconductor processing. Anti-static tape is a transparent polyester film, ideal for use near electronic components and assemblies. They generate less than 50 volts on unwind and removal from stainless steel, helping to prevent ESD damage to sensitive electronics components in manufacturing environments. The turboelectric charge may vary with your application and environment. Antistatic tape is especially suited for office, clean room and workstation use, closing static shielding bags, container sealing/holding and label stock. These anti-static cleanroom tapes are made of cellophane with rubber based adhesive and are specially designed for use in ESD-sensitive environments. Dicing tape is a backing tape used during wafer dicing, the cutting apart of pieces of semiconductor material following wafer micro fabrication. The tape holds the pieces of semiconductor, known as dies, together during the cutting process, mounting them to a thin metal frame. The dies are later removed from the dicing tape further on in the electronics manufacturing process. Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the dies in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafer.[1] It is available in a variety of thicknesses, from 75 [2] to 150 micrometers, with a variety of adhesive strengths, designed for various chip sizes and materials. UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal.
